The electrodeposition and electrocatalytic properties of copper–palladium alloys

The codeposition of copper and palladium from solutions of CuSO4 and PdSO4 in 0.6 M HClO4 is investigated using microdisc voltammetry. It is shown that good quality coatings of CuPd may be deposited and the composition may be controlled either through the deposition potential or the Cu(II)/Pd(II) ratio in solution. While the deposits seem to be amorphous and the copper can be dissolved anodically, the voltammetry indicates that the palladium stabilises the copper to dissolution. The CuPd alloys are effective catalysts for nitrate reduction in alkaline media.