The thermal effect of piezoelectric medium for anti-plane problem under high electrical impact loading

In present paper, the anti-plane problem of thermal effect near crack tip region of piezoelectric material subjected to electrical impact loading is investigated by means of the integral transforms and the singular integral equations. By introducing the thermal power, the temperature field near crack tip is finally obtained on the basis of the hypotheses of the uncoupling between the thermal field and the electro-mechanical fields and the adiabatic approximation. The numerical results indicate that a high temperature field of small region near crack tip is deduced when high electrical impact load is applied. Moreover, the results show that the temperature field strongly depends on crack size. However, the thermal effect of mechanical impact comparing with electrical impact may almost be neglected.