Title of article :
Molecular dynamics study of the copper cluster deposition on a Cu(0 1 0) surface
Author/Authors :
Resende، نويسنده , , F.J. and Costa، نويسنده , , B.V.، نويسنده ,
Issue Information :
هفته نامه با شماره پیاپی سال 2001
Abstract :
The deposition of copper cluster on the Cu(0 1 0) surface is studied by molecular dynamics simulation. We used a many-body potential based on the tight-binding model to describe the Cu–Cu interaction. Several quantities are calculated to study the influence of the substrate size and substrate temperature on the cluster deposition phenomenon.
Keywords :
Copper , Clusters , Molecular dynamics , surface diffusion
Journal title :
Surface Science
Journal title :
Surface Science