Title of article
Parallel crack near the interface of magnetoelectroelastic bimaterials
Author/Authors
Tian، نويسنده , , Wen-Ye and Gabbert، نويسنده , , Ulrich، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2005
Pages
6
From page
562
To page
567
Abstract
A parallel crack near the interface of magnetoelectroelastic bimaterials is considered. The crack is modelled by using the continuously distributed edge dislocations, which are described by the density functions defined on the crack line. With the aid of the fundamental solution for the edge dislocation, the present problem is reduced to a system of singular integral equations, which can be numerically solved by using the Chebyshev numerical integration technique. Then, the stress intensity factor (SIF), the magnetic induction intensity factor (MIIF) and the electric displacement intensity factor (EDIF) at the crack tips are evaluated. Using these fracture criteria, the cracking behaviour of magnetoelectroelastic bimaterials is investigated. Numerical examples demonstrate that the interface, mechanical load, magnetic load and material mismatch condition are all important factors affecting the fracture toughness of the magnetoelectroelastic bimaterials.
Keywords
Magnetoelectroelastic bimaterial , Interface , Crack , Edge dislocation
Journal title
Computational Materials Science
Serial Year
2005
Journal title
Computational Materials Science
Record number
1680730
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