Electromigration induced stress analysis using fully coupled mechanical–diffusion equations with nonlinear material properties

Electromigration is a major road block in the pursuit of further miniaturized electronics. In the next generation micro and sub micro electronics current density is expected to exceed 107 A/cm2. In this paper an electromigration induced strain-current density model is proposed and implemented in finite element procedure for solution of boundary/initial value electromigration problems. Numerical simulations are compared with experimental data. Comparisons validate the model.