Title of article
Vacancy diffusion in the Cu(0 0 1) surface I: an STM study
Author/Authors
van Gastel، نويسنده , , R. and Somfai، نويسنده , , E. and van Albada، نويسنده , , S.B. and van Saarloos، نويسنده , , W. and Frenken، نويسنده , , J.W.M.، نويسنده ,
Issue Information
هفته نامه با شماره پیاپی سال 2002
Pages
16
From page
10
To page
25
Abstract
We have used the indium/copper surface alloy to study the dynamics of surface vacancies on the Cu(0 0 1) surface. Individual indium atoms that are embedded within the first layer of the crystal, are used as probes to detect the rapid diffusion of surface vacancies. STM measurements show that these indium atoms make multi-lattice-spacing jumps separated by long time intervals. Temperature dependent waiting time distributions show that the creation and diffusion of thermal vacancies form an Arrhenius type process with individual long jumps being caused by one vacancy only. The length of the long jumps is shown to depend on the specific location of the indium atom and is directly related to the lifetime of vacancies at these sites on the surface. This observation is used to expose the role of step edges as emitting and absorbing boundaries for vacancies.
Keywords
Copper , Scanning tunneling microscopy , surface diffusion , Indium , Surface defects
Journal title
Surface Science
Serial Year
2002
Journal title
Surface Science
Record number
1681765
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