• Title of article

    Effect of tensile strain on adatom diffusion on Cu(1 1 1) surface

  • Author/Authors

    Wang، نويسنده , , Y.X and Pan، نويسنده , , Z.Y. and Li، نويسنده , , Z.J. and Wei، نويسنده , , Q. and Zang، نويسنده , , L.K. and Zhang، نويسنده , , Z.X.، نويسنده ,

  • Issue Information
    هفته نامه با شماره پیاپی سال 2003
  • Pages
    6
  • From page
    137
  • To page
    142
  • Abstract
    The dependence of the adatom diffusion on the strained (1 1 1) surface of Cu metal was investigated using molecular dynamics simulation. It is found that the diffusion coefficient of the Cu adatom on Cu surface decreases with increasing tensile strain at different temperatures where we studied. On the strained surface, the diffusion coefficient still exhibits approximately Arrhenius behavior. The main diffusion is the hopping diffusion. While, with the temperature or the tensile strain raised further, the exchange diffusion appears. And its frequency will increase with these values.
  • Keywords
    Copper , Adatoms , Molecular dynamics , surface diffusion , Surface stress
  • Journal title
    Surface Science
  • Serial Year
    2003
  • Journal title
    Surface Science
  • Record number

    1683989