Title of article
Effect of tensile strain on adatom diffusion on Cu(1 1 1) surface
Author/Authors
Wang، نويسنده , , Y.X and Pan، نويسنده , , Z.Y. and Li، نويسنده , , Z.J. and Wei، نويسنده , , Q. and Zang، نويسنده , , L.K. and Zhang، نويسنده , , Z.X.، نويسنده ,
Issue Information
هفته نامه با شماره پیاپی سال 2003
Pages
6
From page
137
To page
142
Abstract
The dependence of the adatom diffusion on the strained (1 1 1) surface of Cu metal was investigated using molecular dynamics simulation. It is found that the diffusion coefficient of the Cu adatom on Cu surface decreases with increasing tensile strain at different temperatures where we studied. On the strained surface, the diffusion coefficient still exhibits approximately Arrhenius behavior. The main diffusion is the hopping diffusion. While, with the temperature or the tensile strain raised further, the exchange diffusion appears. And its frequency will increase with these values.
Keywords
Copper , Adatoms , Molecular dynamics , surface diffusion , Surface stress
Journal title
Surface Science
Serial Year
2003
Journal title
Surface Science
Record number
1683989
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