Effect of thermomechanical loads on the propagation of crack near the interface brittle/ductile

The purpose of this paper is to understand the combined effect of thermal and mechanical loading on the initiation and behaviour of sub-interface crack in the ceramic. In this study a 2D finite element model has been used to simulated mixed mode crack propagation near the bimaterial interface. The assembly ceramometalic is subjected simultaneously to thermomechanical stress field. The extent of a plastic zone deformation in the vicinity of the crack-tip has a significant influence on the rate of its propagation. The crack growth at the joint specimen under four-point bending (4PB) loading and the influence of residual stresses was also evaluated by the maximum tensile stress criterion. The J-integral at the crack tip is generally expressed by the thermomechanical local stresses. The results obtained show the effect of the temperature gradient ΔT, the size of the crack and the applied stresses on the J-integral.