Title of article
Melting and breaking of ultrathin copper nanobridges
Author/Authors
Hwang، نويسنده , , Ho Jung and Kang، نويسنده , , Jeong Won، نويسنده ,
Issue Information
هفته نامه با شماره پیاپی سال 2003
Pages
8
From page
536
To page
543
Abstract
Thermal properties of Cu nanobridges were investigated using a classical molecular dynamics simulation and a many-body potential function of the second-moment approximation of tight-binding scheme. The caloric curve and the diffusivity of nanobridges showed the information on the melting and breaking of nanobridges.
Keywords
Copper , Molecular dynamics , Surface melting
Journal title
Surface Science
Serial Year
2003
Journal title
Surface Science
Record number
1695867
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