The use of lactic acid-based hot melt adhesive in the industrial lamination process

The suitability of the lactic acid-based hot melt adhesive formulation for the glue lamination process was evaluated. Formulation was a copolymer consisting of poly(l-lactide) and poly(ε-caprolactone) with molar ratio 81:19, respectively. Formulation was chemically stabilized with acetic anhydride to limit the unwanted thermal degradation during the processing. The laminated materials were cardboard and a commercial polylactide based film. l degradation was followed by weight loss, viscosity and molecular weight measurements. Adhesion to the laminated materials and the open time of the adhesive were also determined. found out, that the thermal stability of the adhesive was sufficient for the normal application process. Adhesion to both laminated substrates was good, if the open time of the adhesive was not exceeded.