• Title of article

    Modeling of long-term creep behavior of structural epoxy adhesives

  • Author/Authors

    Feng، نويسنده , , C.-W. and Keong، نويسنده , , C.-W. and Hsueh، نويسنده , , Y.-P. and Wang، نويسنده , , Y.-Y. and Sue، نويسنده , , H.-J.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2005
  • Pages
    10
  • From page
    427
  • To page
    436
  • Abstract
    The mechanical properties of polymeric materials change over time, especially when they are subjected to long-term loading regimes. It is imperative that reliable accelerated tests be developed to determine the long-term time-dependent performance of polymers under different environmental conditions. The long-term creep behaviors of a neat epoxy resin and a commercial structural adhesive for bonding aluminum substrates were investigated. The time–temperature superposition method produced a master curve, allowing for the long-term creep compliance to be estimated. The physics-based coupling model was utilized and found to fit well with the long-term creep master curve. The equivalence of the temperature and moisture effects on the creep compliance of the epoxy adhesives was also addressed. Finally, a methodology for predicting the long-term creep behavior of epoxy adhesives was proposed.
  • Keywords
    A. Epoxy/epoxides , D. Creep , Coupling model , D. Viscoelastic
  • Journal title
    International Journal of Adhesion and Adhesives
  • Serial Year
    2005
  • Journal title
    International Journal of Adhesion and Adhesives
  • Record number

    1698420