Title of article :
Modeling of long-term creep behavior of structural epoxy adhesives
Author/Authors :
Feng، نويسنده , , C.-W. and Keong، نويسنده , , C.-W. and Hsueh، نويسنده , , Y.-P. and Wang، نويسنده , , Y.-Y. and Sue، نويسنده , , H.-J.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2005
Pages :
10
From page :
427
To page :
436
Abstract :
The mechanical properties of polymeric materials change over time, especially when they are subjected to long-term loading regimes. It is imperative that reliable accelerated tests be developed to determine the long-term time-dependent performance of polymers under different environmental conditions. The long-term creep behaviors of a neat epoxy resin and a commercial structural adhesive for bonding aluminum substrates were investigated. The time–temperature superposition method produced a master curve, allowing for the long-term creep compliance to be estimated. The physics-based coupling model was utilized and found to fit well with the long-term creep master curve. The equivalence of the temperature and moisture effects on the creep compliance of the epoxy adhesives was also addressed. Finally, a methodology for predicting the long-term creep behavior of epoxy adhesives was proposed.
Keywords :
A. Epoxy/epoxides , D. Creep , Coupling model , D. Viscoelastic
Journal title :
International Journal of Adhesion and Adhesives
Serial Year :
2005
Journal title :
International Journal of Adhesion and Adhesives
Record number :
1698420
Link To Document :
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