Title of article
Modeling of long-term creep behavior of structural epoxy adhesives
Author/Authors
Feng، نويسنده , , C.-W. and Keong، نويسنده , , C.-W. and Hsueh، نويسنده , , Y.-P. and Wang، نويسنده , , Y.-Y. and Sue، نويسنده , , H.-J.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2005
Pages
10
From page
427
To page
436
Abstract
The mechanical properties of polymeric materials change over time, especially when they are subjected to long-term loading regimes. It is imperative that reliable accelerated tests be developed to determine the long-term time-dependent performance of polymers under different environmental conditions. The long-term creep behaviors of a neat epoxy resin and a commercial structural adhesive for bonding aluminum substrates were investigated. The time–temperature superposition method produced a master curve, allowing for the long-term creep compliance to be estimated. The physics-based coupling model was utilized and found to fit well with the long-term creep master curve. The equivalence of the temperature and moisture effects on the creep compliance of the epoxy adhesives was also addressed. Finally, a methodology for predicting the long-term creep behavior of epoxy adhesives was proposed.
Keywords
A. Epoxy/epoxides , D. Creep , Coupling model , D. Viscoelastic
Journal title
International Journal of Adhesion and Adhesives
Serial Year
2005
Journal title
International Journal of Adhesion and Adhesives
Record number
1698420
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