Title of article
Electroless plating of silver on graphite powders and the study of its conductive adhesive
Author/Authors
Tongxiang، نويسنده , , Liang and Wenli، نويسنده , , Guo and Yinghui، نويسنده , , Yan and Chunhe، نويسنده , , Tang، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2008
Pages
4
From page
55
To page
58
Abstract
In this paper, silver plating graphite powders were developed by electroless plating method. The density of silver plating graphite powders was 2.61 g/cm3 and the ratio of silver for the powders was 25 wt%. After being mixed with epoxy resin and curing agent, silver plating graphite powders conductive adhesive was obtained, with the percolation concentration of 28 vol%. Compared to pure Ag conductive adhesive, the new conductive adhesive has the advantage of low cost. Adhesives based on the graphite or Ag plating graphite powders exhibited higher tensile strength and larger failure elongations than pure Ag conductive adhesive.
Keywords
Graphite powders , Conductive adhesive , Silver plating
Journal title
International Journal of Adhesion and Adhesives
Serial Year
2008
Journal title
International Journal of Adhesion and Adhesives
Record number
1698786
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