Title of article :
Adhesive compliance effect in mode I separation: Profilometry approach
Author/Authors :
Budzik، نويسنده , , M. and Jumel، نويسنده , , J. and Shanahan، نويسنده , , M.E.R.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2011
Pages :
11
From page :
135
To page :
145
Abstract :
The effect of adhesive compliance on the deflection of a loaded, bonded beam was studied using laser profilometry. Experimental data obtained were compared with both Euler–Bernoulli (encastré) and Winkler (one parameter elastic foundation) models. A third, analytical, 2D model, based on shear within the adhesive layer (two parameter elastic foundation), was introduced. Finite element analysis (FEA) was also used to study the effect of adhesive compliance parallel to the bondline. Although the Winkler model already gives good correlation, both the analytical 2D and FEA models proposed were found to be in excellent agreement with experimental results, indicating that adhesive shearing rigidity should be taken into account. We present experimental evidence of the adhesive compliance effect when mode I loading is applied.
Keywords :
Stress analysis , Wedge tests , fracture , Joint design
Journal title :
International Journal of Adhesion and Adhesives
Serial Year :
2011
Journal title :
International Journal of Adhesion and Adhesives
Record number :
1699304
Link To Document :
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