Title of article
The surface tension and density of the Cu–Ag–In alloys
Author/Authors
Fima، نويسنده , , Przemyslaw and Wiater، نويسنده , , Katarzyna and Kucharski، نويسنده , , Marian، نويسنده ,
Issue Information
هفته نامه با شماره پیاپی سال 2007
Pages
7
From page
3481
To page
3487
Abstract
The surface tension and the densities of the Cu–Ag–In alloys have been measured by means of the sessile drop method. The density of these alloys depends linearly on temperature in the case of all the investigated compositions. The surface tension shows a linear dependence on temperature except for the lowest temperatures. For most of the alloys, the surface tension at the lowest temperature is lower than that predicted by the straight line. The experimental values of the surface tension of the Cu–Ag–In alloys are compared with those computed from the model, and quite good agreement is observed.
Keywords
Cu–Ag–In alloys , Surface Tension , Density , Lead-free solders
Journal title
Surface Science
Serial Year
2007
Journal title
Surface Science
Record number
1701205
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