• Title of article

    The surface tension and density of the Cu–Ag–In alloys

  • Author/Authors

    Fima، نويسنده , , Przemyslaw and Wiater، نويسنده , , Katarzyna and Kucharski، نويسنده , , Marian، نويسنده ,

  • Issue Information
    هفته نامه با شماره پیاپی سال 2007
  • Pages
    7
  • From page
    3481
  • To page
    3487
  • Abstract
    The surface tension and the densities of the Cu–Ag–In alloys have been measured by means of the sessile drop method. The density of these alloys depends linearly on temperature in the case of all the investigated compositions. The surface tension shows a linear dependence on temperature except for the lowest temperatures. For most of the alloys, the surface tension at the lowest temperature is lower than that predicted by the straight line. The experimental values of the surface tension of the Cu–Ag–In alloys are compared with those computed from the model, and quite good agreement is observed.
  • Keywords
    Cu–Ag–In alloys , Surface Tension , Density , Lead-free solders
  • Journal title
    Surface Science
  • Serial Year
    2007
  • Journal title
    Surface Science
  • Record number

    1701205