• Title of article

    Interaction of Cu atoms with ordered 2D oligopyridine networks

  • Author/Authors

    Breitruck، نويسنده , , A. and Hoster، نويسنده , , H.E. Markus Meier، نويسنده , , C. and Ziener، نويسنده , , U. and Behm، نويسنده , , R.J.، نويسنده ,

  • Issue Information
    هفته نامه با شماره پیاپی سال 2007
  • Pages
    6
  • From page
    4200
  • To page
    4205
  • Abstract
    The effect of Cu deposition on pre-deposited ordered oligopyridine networks on HOPG was investigated by scanning tunneling microscopy (STM) under ultrahigh vacuum (UHV) conditions. Deposition of small amounts of Cu and subsequent annealing results in the formation of a new hexagonal metal organic structure, coexisting with the previous quasiquadratic network (QQN) phase. In the new phase, the oligopyridines are dominantly linked by incorporated Cu centers. The high stability of the bonds between pyridyl nitrogen atoms and Cu2 dimers, which is the structure determining element in the metal organic network, overcompensates the loss in C–H⋯N bridge interaction, which is the dominant interaction in the QQN phase. The Cu2 mediated gain in intermolecular interaction energy provides the driving force for the Cu induced structural transition, from QQN phase to the hexagonal metal organic network structure.
  • Keywords
    Metal–organic network , Metal–ligand interactions , Scanning tunneling microscopy , Self assembly , HOPG , Oligopyridine
  • Journal title
    Surface Science
  • Serial Year
    2007
  • Journal title
    Surface Science
  • Record number

    1701650