Title of article :
Growth and self-assembly of MnN overlayers on Cu(0 0 1)
Author/Authors :
Liu، نويسنده , , Xiangdong and Lu، نويسنده , , Bin and Iimori، نويسنده , , Takushi and Nakatsuji، نويسنده , , Kan and Komori، نويسنده , , Fumio، نويسنده ,
Issue Information :
هفته نامه با شماره پیاپی سال 2008
Pages :
8
From page :
1844
To page :
1851
Abstract :
The growth of MnN overlayers on Cu(0 0 1) has been investigated by low energy electron diffraction and scanning tunneling microscopy with emphasis on the morphology evolution with coverage. A striking feature in the growth is the formation of the self-assembled two-dimensional superstructure at the coverage of 0.9 ML. At this coverage, the MnN nano-islands show a square shape and a well-defined size. They are regularly arrayed with a periodicity of (3.5 ± 0.1) nanometer and form a two-dimensional square superstructure. The MnN island superstructure is stabilized by an unconventional short-range mechanism. A structural model has been proposed to explain the self-assembly and the high-quality of the superstructure. To explore possible wide applications of the new self-assembly mechanism, the growths of MnN on Pd(0 0 1) and calcium nitride on Cu(0 0 1) have also been investigated. MnN overlayers on Pd(0 0 1) present a layer-by-layer-like growth behavior, and highly ordered calcium nitride nanostructure is formed on Cu(0 0 1). Simple discussion is made on the conditions under which the novel mechanism leading to the self-assembly of MnN islands can be applied to other systems. We propose that a large lattice misfit between the overlayer and the substrate, low vacancy formation energy for the substrate, moderate interfacial bonding strength, and a large elastic constant for the overlayer compared with the substrate could be important factors for the split growth and self-assembly.
Keywords :
0  , Cu(0  , 1) , Pd(0  , 0  , MnN , Metastable CaN , SELF-ASSEMBLY , 1) , stress relaxation
Journal title :
Surface Science
Serial Year :
2008
Journal title :
Surface Science
Record number :
1703248
Link To Document :
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