Title of article :
Characteristics of epoxy resin cured with in situ polymerized curing agent
Author/Authors :
Mimura، نويسنده , , K and Ito، نويسنده , , H، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2002
Pages :
8
From page :
7559
To page :
7566
Abstract :
In order to improve the heat resistance of a cured epoxy resin together with reducing the viscosity of the resin composition, an epoxy resin was cured with a curing agent formed from the radical copolymerization of vinyl monomers during the cure process of the epoxy resin. N-phenylmaleimide and p-acetoxystyrene were used as vinyl monomers of the curing agent. The epoxy resin was cured by the insertion reaction of the ester group of the in situ polymerized curing agent and the epoxy group of the epoxy resin. In the cure system of the epoxy and the phenol resins, reduction of the viscosity of the resin composition was achieved by replacing some or all of the phenol resin with these monomers. When all phenol resins were replaced by these monomers, the viscosity of resin composition (0.01 Pa s at 70 °C) decreased by about 1/2000 compared with that of the system with only phenol resin (21 Pa s at 70 °C). The glass transition temperature (Tg) of the cured resin with no phenols was 174 °C, an improvement of 17 °C compared with that of the system cured with only phenol resin. The flexural strength of the new resins remained unchanged.
Keywords :
heat resistance , Epoxy Resin , Low viscosity
Journal title :
Polymer
Serial Year :
2002
Journal title :
Polymer
Record number :
1718876
Link To Document :
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