Novel thermosetting resins based on 4-(N-maleimidophenyl)glycidylether: II. Bismaleimides and polybismaleimides

Bismaleimides, having epoxy backbone linkages and various bridging groups, were prepared through reacting 4-(N-maleimidophenyl)glycidylether with various biphenol and silandiol compounds. The preparation route provided a convenient approach of introducing specific groups into the bridging groups of bismaleimides to alter their properties. The prepared bismaleimides in this study exhibited good oranosolubility, low melting points, and wide processing windows, further to indicate their excellent processability. The cured polymers were found having high glass transition temperatures above 210 °C and good thermal stability over 350 °C. The polybismaleimide having silicon group, which showed fairly good thermo-oxidative stability and low amount of volatiles, were suitably being considered as flame retardant for other polymeric materials.