Title of article
Heat transport in epoxy networks: A molecular dynamics study
Author/Authors
Varshney، نويسنده , , Vikas and Patnaik، نويسنده , , Soumya S. and Roy، نويسنده , , Ajit K. and Farmer، نويسنده , , Barry L.، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2009
Pages
8
From page
3378
To page
3385
Abstract
In this article, thermal behavior of an epoxy based thermoset polymer has been discussed using atomistic molecular dynamics simulations. The simulations were performed on crosslinked network of EPON-862 and curing agent-W (DETDA) using consistent valence force field (CVFF). Thermal conductivity was calculated using both equilibrium as well as non-equilibrium molecular dynamics approaches and the results were found to be in good agreement with experimental findings. Different contributions of heat flux vector towards thermal conductivity and their possible coupling are discussed in terms of various convective and virial contributions. In addition, discussion of power spectra analysis of velocity autocorrelation function for crosslinked network shows a broad distribution of low frequency vibrational modes suggesting distribution of relaxation times.
Keywords
thermal conductivity , Epoxy network , Molecular dynamics
Journal title
Polymer
Serial Year
2009
Journal title
Polymer
Record number
1733018
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