Title of article :
Fluorinated phenylethynyl-terminated imide oligomers with reduced melt viscosity and enhanced melt stability
Author/Authors :
Yang، نويسنده , , Yang and Fan، نويسنده , , Lin and Qu، نويسنده , , Ximing and Ji، نويسنده , , Mian and Yang، نويسنده , , Shiyong، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2011
Abstract :
Two novel fluorinated phenyethynyl-contained endcapping agents, 4-(3-trifluoromethyl-1-phenylethynyl)phthalic anhydride (3F-PEPA) and 4-(3,5-bistrifluoromethyl-1-phenylethynyl)phthalic anhydride (6F-PEPA) were synthesized, which were employed to synthesize two fluorinated model compounds, N-phenyl-4(3-trifluoromethyl)-phenylethynylphthalimide (3F-M) and N-phenyl-4(3,5-bitrifluoromethyl)-phenylethynyl phthalimide (6F-M). The thermal cure kinetics of 3F-M and 6F-M were analyzed using DSC and compared to the unfluorinated derivative, N-phenyl-4-phenylethynylphthalimide (PEPA-M). The thermal cure temperatures of 3F-M and 6F-M were 399 and 412 °C, which were 22 and 35 °C higher than that of PEPA-M, respectively. The thermal cure kinetics of 3F-M and 6F-M best fit a first-order rate law, although 3F-M and 6F-M reacted slower than PEPA-M. However, the exothermic enthalpy of 3F-M and 6F-M were only half of PEPA-M. Based on the model compounds study, a series of fluorinated phenylethynyl-terminated imide oligomers (F-PETIs) with different calculated molecular weights (Calcʹd Mn) were synthesized by thermal polycondensation of 2,3,3′,4′-biphenyltetracarboxylic acid dianhydride (a-BPDA) and 3,4′-oxydianiline (3,4′-ODA) using 3F-PEPA or 6F-PEPA as the endcapping agent. The substituent effects of the trifluoromethyl (−CF3) groups on the thermal cure behavior and melt processability of F-PETIs were systematically investigated. Experimental results reveal that the melt processability of F-PETI was apparently improved by the reduced resin melt viscosities and the enhanced melt stability due to the incorporation of the −CF3 groups in the imide backbone. All of those F-PETIs exhibit outstanding thermal and mechanical properties.
Keywords :
Imide oligomer , Melt processability , Thermal-cured polyimides