Title of article
Dissolving polymer microneedle patches for rapid and efficient transdermal delivery of insulin to diabetic rats
Author/Authors
Ling، نويسنده , , Ming-Hung and Chen، نويسنده , , Mei-Chin، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2013
Pages
10
From page
8952
To page
8961
Abstract
This study presents a dissolving microneedle patch, composed of starch and gelatin, for the rapid and efficient transdermal delivery of insulin. The microneedles completely dissolve after insertion into the skin for 5 min, quickly releasing their encapsulated payload into the skin. A histological examination shows that the microneedles have sufficient mechanical strength to be inserted in vitro into porcine skin to a depth of approximately 200 μm and in vivo into rat skin to 200–250 μm depth. This penetration depth does not induce notable skin irritation or pain sensation. To evaluate the feasibility of using these dissolving microneedles for diabetes treatment insulin-loaded microneedles were administered to diabetic rats using a homemade applicator. Pharmacodynamic and pharmacokinetic results show a similar hypoglycemic effect in rats receiving insulin-loaded microneedles and a subcutaneous injection of insulin. The relative pharmacological availability and relative bioavailability of insulin were both approximately 92%, demonstrating that insulin retains its pharmacological activity after encapsulation and release from the microneedles. Storage stability analysis confirms that more than 90% of the insulin remained in the microneedles even after storage at 25 or 37 °C for 1 month. These results confirm that the proposed starch/gelatin microneedles enable stable encapsulation of bioactive molecules and have great potential for transdermal delivery of protein drugs in a relatively painless, rapid, and convenient manner.
Keywords
Bioavailability , Hypoglycemic effect , polysaccharide , protein delivery , Bolus release
Journal title
Acta Biomaterialia
Serial Year
2013
Journal title
Acta Biomaterialia
Record number
1757550
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