Title of article :
Electrochemical reduction of Cu2+ without surface trapping on synthetic conductive diamond electrodes
Author/Authors :
Nakabayashi، نويسنده , , Seiichiro and Tryk، نويسنده , , Donald A and Fujishima، نويسنده , , Akira and Ohta، نويسنده , , Narumi، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Pages :
5
From page :
409
To page :
413
Abstract :
The electrochemical reduction of metal ions is commonly referred to as `electrodepositionʹ because the reduced metal is trapped on the surface, and a new solid phase is formed. We present evidence for a clear deviation from this general concept on the conductive boron-doped CVD diamond electrode, where the electrochemical reduction of copper proceeds with negligible deposition of the metal on the electrode and the product is a colloid composed of the metal clusters.
Journal title :
Chemical Physics Letters
Serial Year :
1999
Journal title :
Chemical Physics Letters
Record number :
1776719
Link To Document :
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