Author/Authors :
Kim، نويسنده , , Yoonhyun and Lee، نويسنده , , Byoungyoon and Yang، نويسنده , , Seungnam and Byun، نويسنده , , Inho and Jeong، نويسنده , , Inbum and Cho، نويسنده , , Sung Min، نويسنده ,
Abstract :
We have synthesized nano-sized copper hydroxide powder and copper (II) neodecanoate complex that can be decomposed to form copper metal films. Copper conductive ink was then prepared by mixing the powder and complex with a binder in terpineol. The lowest resistivity of 12.5 μΩ cm and 5B level of adhesion strength were obtained with 5% addition of epoxy resin as a binder. The copper ink was then applied to fabricate a loop-type RFID antenna tag and the performance of the antenna was compared with that of conventional copper-etched and silver-paste antenna. The fabricated RFID antenna showed comparable performance to the conventional RFID antenna.
Keywords :
Copper ink , RFID antenna , Metal film , Low temperature curing