Characteristics of low-temperature-grown GaN films on Si(111)

In this paper, we report on the characteristics of GaN films grown on Si(111) at a low temperature (200 °C) by electron cyclotron resonance (ECR) plasma-assisted metalorganic chemical vapor deposition (PA-MOCVD). Structural analysis of the GaN films was performed by using scanning electron microscopy (SEM), atomic force miscroscopy (AFM), X-ray diffraction (XRD), energy dispersive X-ray analysis (EDX), and Rutherford backscattering spectrometry (RBS). Post deposition analysis revealed high quality crystalline GaN was obtained at this low temperature. Electrical analysis of the GaN films was done by using current–voltage (I–V) measurements where electrical characterizations were carried on GaN/Si heterojunction and Schottky barrier diodes. Rectification behaviour was observed for the isotype GaN/Si (n–n) heterojunction. Ideality factors and Schottky barrier heights for Ni and Cr Schottky barriers on GaN, were deduced to be 1.4 and 1.7; and 0.62 and 0.64 eV, respectively.