Comparison of substrate temperature and deposition rate between modified pulsed arc process and d.c. arc process

The interaction of the substrate temperature and the deposition rate in a vacuum arc deposition process were investigated with regards to dependence on static and dynamic arc current parameters. Two different deposition systems both for industry as well as for laboratory application distinguished in shape and volume of the recipient were used for the experiments. In reference to the d.c. process one can achieve the same deposition rate at a noticeably lower substrate temperature when using the modified pulsed arc process. Furthermore, it is obvious without a detailed analysis that the quality of the coatings deposited by the pulsed arc is fairly higher. In order to control the substrate temperature via the pulse parameters the r.m.s. ion current has to be changed (at a constant average current). Using a theoretical model a decreased substrate temperature at higher ion energy was found.