Ion-assisted deposition of copper using an inverter plasma

Adhesive Cu deposition using an inverter plasma was studied. Using an inverter power supply to produce a pulse plasma, it is possible to apply high voltage in one direction and low voltage in the other, and to perform deposition by a process of sputtering alternating with ion assistance. We deposited Cu film by setting the Cu target in front of the substrate using Si wafer and glass. Deposited films were examined by a peel-off test using Scotch tape. They exhibited excellent adhesion.