Fundamentals and applications of late post-discharge processes

Fundamental studies on post-discharges deal with the understanding and the modelling of transport of active species and their interactions with surfaces. Coupling kinetic models of volume and surface processes is a major step in the numerical modelling of surface treatments. Restricted chemical reaction pathways, occurring in post-discharge, are a main advantage in understanding basic phenomena. Efforts to both model and control post-discharge processes have helped to optimise applications of current interest in industry. Nitriding, enhancement of polymer printability, adhesion and wettability properties or remote plasma enhanced chemical vapour deposition of thin films are used for material processing applications. New developments are devoted to surface cleaning and low temperature sterilisation. Versatility of late post-discharge processes may be used for duplex treatments.