Title of article
Ion nitriding of Al: growth kinetics and characterisation of the nitride layer
Author/Authors
Telbizova، نويسنده , , T. and Parascandola، نويسنده , , S. and Prokert، نويسنده , , F. and Barradas، نويسنده , , N.P. and Richter، نويسنده , , E. and Mِller، نويسنده , , W.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2001
Pages
6
From page
1028
To page
1033
Abstract
To study the kinetics of aluminium (Al) ion nitriding, a series of experiments has been performed at fixed ion beam parameters and substrate temperatures varied from 250 to 400°C at intervals of 50°C. The nitride layers have been analysed by nuclear reaction analysis (NRA), elastic recoil detection analysis (ERDA), X-ray diffraction (XRD) and scanning electron microscopy (SEM). Depending on the experimental conditions, the nitriding kinetics are either controlled by the delivery of N ions or by the diffusion of Al atoms. Furthermore, the growth of the nitride layer is limited by poor layer adhesion. XRD analysis reveals the formation of a hexagonal AlN-phase plus a small fraction of the cubic AlN-phase.
Keywords
Growth kinetics , AL , Nitride layer , ion nitriding
Journal title
Surface and Coatings Technology
Serial Year
2001
Journal title
Surface and Coatings Technology
Record number
1802419
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