Title of article :
A comparative study on the crystallization behavior of electroless NiP and NiCuP deposits
Author/Authors :
Yu، نويسنده , , Hui-Sheng and Luo، نويسنده , , Shoufu and Wang، نويسنده , , Yong-Rui، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2001
Pages :
6
From page :
143
To page :
148
Abstract :
The crystallization behavior of electroless NiP and NiCuP was studied comparatively by using differential scanning calorimetry and X-ray diffractometry. It is apparent that low-P NiP deposits transform to the stable phase Ni3P directly, but low-P (high-Cu) NiCuP deposits transform to the metastable phase Ni5P2 first, and then to the stable Ni3P. Both the hypereutectic amorphous NiP deposits and amorphous NiCuP deposits with high phosphorus content transform to the metastable phases Ni5P2 and Ni12P5 first, then to the stable phase Ni3P. For the amorphous NiP and NiCuP deposits with P content of approximately 10 wt.%, the crystallization temperature of the latter is markedly higher than that of the former. In addition, the crystallization temperature of the hypereutectic NiP deposit is nearly the same as that of the amorphous NiCuP deposit with a similar P content. For the crystalline NiP and NiCuP deposits with low P content, the temperature at which the stable Ni3P forms in the latter is obviously higher than that of the former.
Journal title :
Surface and Coatings Technology
Serial Year :
2001
Journal title :
Surface and Coatings Technology
Record number :
1802891
Link To Document :
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