Magnetic properties of thin CoNiPCu films deposited from electroless plating solution with simultaneous electrolysis

CoNiP and CoNiPCu films were plated both electrolessly and with simultaneous electrolysis applied. The solutions contained glycine as ligand and ratio Co2+:Ni2+=0.06:0.04 at pH 9 and 10. An increase in Cu2+ concentration up to 3 mmol l−1 decreased Co and increased Cu content in the films. With an increase in cathodic polarization, the Cu content of the films decreased and approached a constant value. Films coercivity passed through the maximum, which was determined by such a potential which enabled to get approximately 5.5% of phosphorus in the film and, thus, to form a specific microstructure. The increase in Cu2+ concentration resulted in a decrease of coercivity maximum due to the formation of the film with finer grains.