The influence of artificial diamond additions on the formation and properties of an electroplated copper metal matrix coating

The matrix durability properties were improved when micrometer-sized artificial diamond particles were incorporated into an electroplated copper matrix. Those diamond particles have a hardening effect on the metal matrix and its microhardness is increased fourfold. Copper composite coatings are distinguished for their low electrical resistivity in a temperature range from 170 to 400 K. The composite matrix has a fine-crystallitic structure and shows higher electrical resistivity. The microroughness of the surface increased; the Ra is 0.6–0.8, whereas the Ra of pure Cu is 0.29. The copper composite coating became a little softer (from 750 to 394 kgf/mm2) after heat treatment at 370 K in contrast to a pure copper coating (from 180 to 160 kgf/mm2). The thermal stability has a temperature limit up to 600 K both for a pure copper coating and a composite coating.