Bonding strength of alumina tiles joined using capacitor discharge technique

A capacitor discharge joining technique used to fabricate alumina–titanium interlayer–alumina joint was investigated to clarify the influence of an input energy and a compressing pressure on bonding strength. A high-current pulse was generated using 8.3-μF capacitor and an Ignitron closing switch. The alumina tiles were successfully bonded when the input energy is larger than the vaporization energy of a titanium foil used as an interlayer. The bonding strength increases with increasing the input energy into the foil. The bonding strength also increases from 600 to 1600 N with increasing compressing pressure of the alumina tiles from 1.1 to 8.3 MPa at 0.25-cm width of the titanium foil.