A study on the synthesis and formation behavior of nanostructured TiN films by copper doping

Ti–Cu–N nanocomposite films with varying copper content were deposited by simultaneous co-deposition of titanium nitride and copper using a reactive arc ion plating and magnetron sputtering hybrid system. The structure and mechanical properties of these films were found to be dependent on the copper concentration. A maximum hardness of 42 GPa was exhibited by Ti–Cu–N film containing 1.5 at.% Cu. The role of a soft metallic phase in Ti–Cu–N nanostructured films containing one hard and one soft phase is also discussed.