Title of article :
Nanometer-scale multilayer coatings combining a soft metallic phase and a hard nitride phase: study of the interface structure and morphology
Author/Authors :
Tse، نويسنده , , Y.Y. and Babonneau، نويسنده , , D. and Michel، نويسنده , , A. and Abadias، نويسنده , , G.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2004
Pages :
8
From page :
470
To page :
477
Abstract :
The present study reports on the microstructure and interface morphology of multilayered films consisting of inherently soft metal layers (Cu or Ag) separated by hard titanium nitride (TiN) layers. Dual ion beam sputtering technique was used to synthesise multilayers with modulation periods (Λ ranging between 2.5 and 50 nm). Both high-angle X-ray diffraction (XRD), X-ray reflectivity (XRR) combined with grazing incidence small angle X-ray scattering (GISAXS) and transmission electron microscopy (TEM) techniques were used to globally characterise the multilayers structure as well as the nature of the interfaces. Symmetric XRD profiles revealed that all the constituents in TiN/Cu and TiN/Ag multilayers exhibited a [002]-out-of-plane texture, while pure Ag and Cu films had a (111) preferred orientation. For TiN/Cu, a cube-on-cube epitaxial growth was found for all Λ values, with semi-coherent interfaces. High resolution TEM observations showed the presence of interfacial misfit dislocations and micro-twins, which were formed to relax the large misfit strain (15.9%) between the two fcc lattices. They also revealed the presence of facetted islands in the Cu layers. For TiN/Ag, in spite of the much smaller lattice mismatch (3.6%), no strong preferred orientations were observed for Λ>20 nm. In both multilayer systems, XRR spectra exhibited a large number of superlattice reflections, while the high-angle spectra did not reveal such features, indicating that although a fairly constant bilayer thickness over the multilayer stack was achieved, the structural coherency length was rather small. The interfacial roughness was found to be much larger in TiN/Ag than TiN/Cu.
Keywords :
Multilayers , TiN/Cu , Surface roughness , TiN/Ag , Interfacial roughness
Journal title :
Surface and Coatings Technology
Serial Year :
2004
Journal title :
Surface and Coatings Technology
Record number :
1807738
Link To Document :
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