Magnetic null discharge sputtering with full target erosion

The article reports on the operation of a novel-type sputtering system based on the magnetic null discharge concept for the thin film fabrication process. The unique feature of the system is the plasma production around the magnetic null field region on the target surface. The calculated electron motion around the magnetic null region on the target surface showed the complex meandering motion, and the measured electron and ion properties possessed peaks on the null region like in the original null plasma concept. Experimentally, it was also found that the shape of high-density and low-temperature plasma in the magnetic null field region was also similar to that of the inductive-type original null plasma. It is therefore expected that the dynamic plasma control over the target surface will be realized since rotating and arranging the magnets can actively control the plasma peaks. With sputtering application, it is possible to achieve almost full target erosion and thus significantly increase the usage lifetime of target. Also, it can be found from the result of a thin film deposition that the system is very useful for the performance of sputtering.