Comparison of nanometer-scale gold structures electrodeposited on Au and Pt seed electrode

We report a new method to fabricate nanometer-scale gaps between two Au metal electrodes electrodeposited on either Au or Pt seed layer. The techniques used in this work are conventional photolithography, where specifically designed photomask and lift-off methods and pulse/DC electroplating are used. In addition, the effects of pulse plating variables are investigated with respect to DC plating. The results obtained from the electroplated Au films on the Au seed layer are compared with those on the Pt one. The method is simple, inexpensive, faster, and robust, and gaps between metal electrodes could be easily controlled to nanometer-scale dimensions.