• Title of article

    The effect of periodic segmentation cracks on the interfacial debonding: Study on interfacial stresses

  • Author/Authors

    Wu، نويسنده , , Chen-Wu and Chen، نويسنده , , Guang-Nan and Zhang، نويسنده , , Kun and Luo، نويسنده , , Geng-Xing and Liang، نويسنده , , Nai-Gang، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2006
  • Pages
    5
  • From page
    287
  • To page
    291
  • Abstract
    Hard coatings on relatively soft substrate always face the danger of debonding along the interface. Interfacial stresses are considered to be the initial driving force for the interfacial debonding of the relatively strong bonded coatings. Interfacial stresses due to the mismatch of strain between the coating and substrate are simulated with FEM firstly. The distribution of the interfacial stresses is achieved, which confirms an excessive stresses concentration near the interface end. Subsequently, the redistribution of interfacial stresses is calculated for a coating with periodic segmentation cracks. Results indicate that the distribution of interfacial stresses is altered greatly with the periodic segmentation cracks. To reveal the effect of the spacing of the periodic segmentation cracks on the distribution of interfacial stresses, different crack density is modeled within the coating. It is found that that the peak values of the interfacial stresses decrease with the increase of crack density, i.e. with reduction of spacing of segmentation cracks.
  • Keywords
    Interfacial stresses , FEM , Periodic segmentation crack , Crack density , Coatings
  • Journal title
    Surface and Coatings Technology
  • Serial Year
    2006
  • Journal title
    Surface and Coatings Technology
  • Record number

    1812949