Use of the reverse pulse plating method to improve the properties of cobalt–molybdenum electrodeposits

Conditions leading to cobalt–molybdenum (Co–Mo) electrodeposits with high Mo percentages were studied. Deposits prepared by means of direct current electroplating showed a large amount of cracks. Maximum amount of Mo in the films was attained by applying deposition potentials in the − 1200 mV to − 1300 mV range. Reverse pulse plating mode has been proved useful for obtaining nanocrystalline, low stressed Co–Mo deposits with similar Mo percentages as in direct current conditions (35–40 wt.%). The coatings were exposed to a static microindentation test, which highlighted that the pulse plated samples were more compact and less fragile than the direct current plated ones.