Improving the adhesion of electroless-nickel coating layer on diamond powder

An electroless-nickel plating method with semi-batch reactor was employed to coat diamond powders. Ni–P fines are known to be a main cause for generating pore structure in the nickel coating layer was eliminated by lowering the rate of reduction by means of temperature, pH and feeding rate of reductant. It was found that at a temperature of 70 °C, pH of 4.8, feeding rate of reductant of 0.25 ml/min the Ni–P fines were entirely eliminated, resulting in a rapid improvement of diamond-coated nickel layer adhesion.