AC powered reactive magnetron deposition of indium tin oxide (ITO) films from a metallic target

Transparent highly conductive indium tin oxide (ITO) films for low cost applications were deposited by a reactive dual magnetron sputter process using metallic targets. The magnetrons were equipped with rectangular (130 × 400 mm2) In:Sn targets (90 wt.% In/10 wt.% Sn). A sine wave power supply was used at a frequency of about 70 kHz. All experiments were done in the transition mode at a constant argon flow of 40 sccm and an oxygen flow varied between 35 and 70 sccm. The total pressure was kept constant at 0.4 Pa. lms were deposited onto silicon and float glass substrates which were either moved in an oscillatory manner (dynamic deposition) or fixed in front of the targets (static mode) during deposition. A dynamic deposition rate of about 100 nm × m/min was obtained at an average power of 2 kW/cathode. The film thickness was adjusted to 500 nm. At an optimised Ar/O2 gas flow ratio of 0.6 we found an electrical resistivity as low as 1.2 × 10− 3 Ω cm. The refractive index of these films was about 2.05 indicating a dense film structure, while the optical absorption of k = 10− 2 qualifies these ITO films for many low cost applications. Moreover, the film structure and texture were investigated by XRD methods. ng a static deposition we have achieved a lower electrical resistivity with a minimum value of 6 × 10− 4 Ω cm. In this case, the resistivity and the transparency, respectively, were not constant over the substrate but depend on the lateral position in front of the target. To explain this inhomogeneity we have performed spatially resolved deposition rate and Langmuir probe measurements and related their results to film structure and properties. In order to improve the film properties at dynamic deposition the growth conditions have to be homogenised at all substrate positions.