High adhesive metal laminate manufacturing by low energy ion cascade treatments

Highly adhesive Cu clad laminates (CCL) without oxygen plasma treatment were fabricated by introducing Ti layer using grid assisted magnetron sputtering. The interfaces of polyimide and titanium obtained were studied by XPS. The results give evidence for the formation of Ti–O–C chemical bonds between two sides of the interface. These chemical bonds are believed to be responsible for the observed mechanical strength of the CCL bonding.