Title of article :
Operating parameters for suspension and solution plasma-spray coatings
Author/Authors :
Fauchais، نويسنده , , P. and Rat، نويسنده , , V. and Coudert، نويسنده , , J.-F. and Etchart-Salas، نويسنده , , R. and Montavon، نويسنده , , G.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2008
Pages :
9
From page :
4309
To page :
4317
Abstract :
The interest to manufacture on large surfaces thick (i.e., 10 to 20 μm, average thickness) finely structured or nano-structured layers is increasingly growing since about 10 years. This explains the interest for suspension plasma spraying (SPS) and solution precursor plasma spraying (SPPS), both allowing manufacturing finely structured layers of thicknesses varying between a few micrometers up to a few hundred of micrometers. SPS aims at processing a suspension of sub-micrometric-sized or even nano-metric-sized solid particles dispersed in a solvent. The liquid solvent permits to inject particles in the thermal flow (i.e., due to their size, a carrier gas cannot play this role). SPTS aims at processing a solution of precursors under the same conditions. Upon evaporation of the liquid, the precursor concentration increases until precipitation, pyrolysis and melting of small droplets. Compared to conventional plasma spraying, SPS and SPPS are by far more complex because fragmentation and vaporization of the liquid control the coating build-up mechanisms. Numerous studies are still necessary to reach a better understanding of involved phenomena and to further develop the technology, among which injection systems, suspension and solution optimizations, spray kinematics, etc. This review presents some recent developments in this field.
Keywords :
Nano-sized feedstock , Finely structured layers , Suspension plasma spraying , Porosity network , Solution precursor plasma spraying , Process parameters , Coating architecture
Journal title :
Surface and Coatings Technology
Serial Year :
2008
Journal title :
Surface and Coatings Technology
Record number :
1819089
Link To Document :
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