Finite element analysis of stress distribution in thermal barrier coatings

A numerical simulation of crack development within APS TBC systems is presented. The TGO thickening and creep deformation of all system constituents is modelled. Two dimensional periodic unit cell is used to examine the effect of interfacial asperity on stress distribution and subsequent delamination of APS TBC. A study of cyclic loading and of creep of the base material on the stress distribution close to the asperity at the TGO/BC interface is made, revealing a small influence influence of both on the stress state in the thermal barrier coating system subjected to temperature loading. Cohesive zone elements at the oxide/ceramic interface model the development of the interfacial micro-crack. The finite element analysis shows that the development of the interfacial crack allows for a micro-crack formation within APS TBC. Subsequent TGO growth results in a tensional zone within the oxide layer. Linking of the micro-cracks at the interface and within TBC through TGO could lead to a coating delamination in the unit cell.