Characterization of nanocrystalline Co–W coatings on Cu substrate, electrodeposited from a citrate-ammonia bath

Cobalt–tungsten nanocrystalline coatings were electrodeposited on copper substrate using different current densities. The deposited coatings were single phase solid solution with an average grain size of about 18 nm, showing a nodular type of surface morphology. By increasing the deposition current density, the density of nodules was increased, with no obvious variation in grain size. Electrochemical impedance spectroscopy (EIS) confirmed the codeposition of tungsten through reduction of tungsten oxide film formed during the electrodeposition process. However, the role of ternary complexes in the bath cannot be ruled out, especially at lower cathodic potentials. The Co–W coating deposited at lower current densities showed higher tungsten content, microhardness, wear resistance and friction coefficient. However, this coating showed an inferior corrosion resistance. By increasing the deposition current density, a low tungsten coating with high corrosion resistant was obtained. This is attributed to the lower value of exchange current density of water reduction in the present of oxygen (i0H2O) achieved on the coating with lower tungsten content.