Hemocompatibility and anti-endothelialization of copper–titanium coating for vena cava filters

The deposition of coatings or films is an acceptable surface modification method for implanted cardiovascular devices. Cu/Ti coatings of various ratios of Cu and Ti atoms were prepared using the vacuum arc plasma deposition method. The phase composition and concentration of elements were investigated via X-ray diffraction and X-photoelectron energy spectrum, respectively. The hemolysis ratio, lactate dehydrogenase (LDH), clotting time, and platelet adhesion of different coatings were characterized to evaluate blood compatibility. The growth of endothelial cells on various coatings was also investigated by observing the morphous and amount of human umbilical vein endothelial cells (HUVECs) under a scanning electron microscope. The Cu/Ti coatings present good blood compatibility. However, with increasing quality ratio of Cu/Ti, the hemolysis ratio increases, and some platelets begin to break slightly. The activated partial thromboplastin times (APTTs) of various coatings are similar to the TiNi substrate, the coatings can also inhibit platelet adhesion, and the amount of platelets of TiNi is more than the Cu/Ti coating from the LDH assay. The adhesion of HUVECs illustrates that endothelial cell adhesion and proliferation are significantly inhibited with > 10 wt.% Cu concentration. A Cu/Ti coating with good compatibility and anti-endothelialization has potential applications for special cardiovascular devices.