Title of article :
Influence of deposition parameters on microstructure and contamination of electrodeposited nickel coatings from additive-free sulphamate bath
Author/Authors :
Savall، نويسنده , , C. and Godon، نويسنده , , A. and Creus، نويسنده , , J. and Feaugas، نويسنده , , X.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2012
Abstract :
The microstructural features at different scales and the chemical composition of nickel coatings were studied in link with deposition parameters in direct-current and pulsed modes. Complementary characterization tools were used, allowing a scale relationship to be established between the nodule sizes, the sizes of coherent scattering regions and the grain sizes. The influence of deposition conditions on crystallographic texture and nodule size was formalized by maps versus pulsed current density (jp) and duty cycle (γ). The analysis of these maps offers the opportunity to demonstrate that the decrease in grain size is dependent on texture formation in relation with nucleation and growth processes. The chemical contamination, especially by light elements, seems to be the main factor linking deposition parameters and microstructure (texture and grain size).
Keywords :
Grain boundaries , Impurities , grain size , Pulsed Electrodeposition , crystallographic texture
Journal title :
Surface and Coatings Technology
Journal title :
Surface and Coatings Technology