Title of article :
Effect of electrodeposition parameters on chemical and morphological characteristics of Cu–Sn coatings from a methanesulfonic acid electrolyte
Author/Authors :
Zanella، نويسنده , , Caterina and Xing، نويسنده , , Sujie and Deflorian، نويسنده , , Flavio، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2013
Pages :
6
From page :
394
To page :
399
Abstract :
Currently Cu–Sn coatings are widely used in numerous commercial productions in replacement of Ni layers especially for decorative arts. In recent decades, researchers are exploring more environment-friendly baths to deposit Cu–Sn coatings to substitute CN− electrolyte which has been widely used as conventional electroplating baths for industrial applications. This paper investigated Cu–Sn deposition from a methanesulfonic acid based bath studying the optimization of deposition parameters. Film composition was varied by changing current density, which leads to a difference in color and final properties. Usually lifetime of tin containing baths is limited because the composition of deposited films has poor stability. In this work the effect of deposition parameters and anode materials on bath and deposits stability is evaluated. In particular, the application of pulse current was considered to improve the quality of coatings at fixed duty cycle while deposition frequency was varied. The coatings deposited under different conditions were compared in term of microstructure and corrosion behavior.
Keywords :
pulse current , Methanesulfonic acid , Copper–tin coatings
Journal title :
Surface and Coatings Technology
Serial Year :
2013
Journal title :
Surface and Coatings Technology
Record number :
1829617
Link To Document :
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