Title of article :
Incorporation effects of Si in TiCx thin films
Author/Authors :
Tengstrand، نويسنده , , O. and Nedfors، نويسنده , , N. and Alling، نويسنده , , John B. and Jansson، نويسنده , , U. and Flink، نويسنده , , A. and Eklund، نويسنده , , P. and Hultman، نويسنده , , L.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2014
Pages :
6
From page :
392
To page :
397
Abstract :
Ti-Si-C thin films with varying Si content between 0 to 10 at.% were deposited by DC magnetron sputtering from elemental targets. The effects on microstructure and lattice parameters were investigated using x-ray diffraction, x-ray photoelectron spectroscopy, transmission electron microscopy, and first-principles calculations. The results show that the growth of pure TiCx onto Al2O3(0001) substrates at a temperature of 350 °C yields (111) epitaxial and understoichiometric films with x ~ 0.7. For Si contents up to 4 at.%, the TiCx epitaxy is retained locally. Si starts to segregate out from the TiCx to column boundaries at concentrations between 1 and 4 at.%, and causes a transition from epitaxial to polycrystalline growth above 4 at.%. Eventually, the top part of the films form a nanocomposite of crystalline TiC grains surrounded by amorphous SiC and C for Si contents studied up to 10 at.%. The results show that Si takes the place of carbon when incorporated in the TiC lattice.
Keywords :
First-Principles Calculations , Thin films , Ti-C , Silicon , Physical vapor deposition (PVD)
Journal title :
Surface and Coatings Technology
Serial Year :
2014
Journal title :
Surface and Coatings Technology
Record number :
1831427
Link To Document :
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