Author/Authors :
Kvashnina، نويسنده , , K.O. and Butorin، نويسنده , , S.M. and Modin، نويسنده , , A. K. Soroka and A. A. Soroka ، نويسنده , , I. and Marcellini، نويسنده , , M. and Nordgren، نويسنده , , J. and Guo، نويسنده , , J.-H. and Werme، نويسنده , , L.، نويسنده ,
Abstract :
This study illustrates how the damage from copper corrosion can be reduced by modifying the chemistry of the copper surface environment. The surface modification of oxidized copper films induced by chemical reaction with Cl− and HCO 3 - in aqueous solutions was monitored by in situ X-ray absorption spectroscopy. The results show that corrosion of copper can be significantly reduced by adding even a small amount of sodium bicarbonate. The studied copper films corroded quickly in chloride solutions, whereas the same solution containing 1.1 mM HCO 3 - prevented or slowed down the corrosion processes.
