Title of article :
Melting of copper under high pressures by molecular dynamics simulation
Author/Authors :
Wu، نويسنده , , Y.N. and Wang، نويسنده , , L.P. and Huang، نويسنده , , Y.S. and Wang، نويسنده , , D.M.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2011
Pages :
4
From page :
217
To page :
220
Abstract :
By large scale molecular dynamics simulations of solid–liquid coexistence, we investigated the melting of copper under pressures from 0 to 400 GPa. The temperatures of liquid and solid regions, and the pressure of the system were calculated to estimate the melting point of copper. The melting curve of copper in our simulations is in general agreement with theoretical prediction of Moriarty. By the pair analysis technique, we found that the icosahedral short-range order in liquid copper increases gradually under compression, and dominates the local microstructure of the molten copper after about 130 GPa.
Journal title :
Chemical Physics Letters
Serial Year :
2011
Journal title :
Chemical Physics Letters
Record number :
1932145
Link To Document :
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